- Packaging :
- Contact Finish Thickness :
4 산물
| 그림 | 모델 | 가격 | 양 | 재고 | 제조사 | 기술 | Series | Part Status | Color | Packaging | Operating Temperature | Mounting Type | Termination | Features | Number of Positions | Number of Rows | Gender | Contact Finish | Contact Finish Thickness | Pitch | Contact Material | Card Type | Contact Type | Number of Positions/Bay/Row | Card Thickness | Read Out | Flange Feature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
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52,760
오늘 배송 + 무료 배송
|
Samtec Inc. | .8MM HIGH SPEED DUAL VERTICAL MO | Edge Rate™ HSEC8 | Active | Black | Tray | -55°C ~ 125°C | Surface Mount | Solder | Board Guide, Board Lock, Locking Ramp | 80 | 2 | Female | Gold | 10.0µin (0.25µm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 40 | 0.062" (1.57mm) | Dual | - | |||
|
|
|
18,540
오늘 배송 + 무료 배송
|
Samtec Inc. | .8MM HIGH SPEED DUAL VERTICAL MO | Edge Rate™ HSEC8 | Active | Black | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Board Guide, Board Lock, Locking Ramp | 50 | 2 | Female | Gold | 30.0µin (0.76µm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 25 | 0.062" (1.57mm) | Dual | - | |||
|
|
|
24,700
오늘 배송 + 무료 배송
|
Samtec Inc. | .8MM HIGH SPEED DUAL VERTICAL MO | Edge Rate™ HSEC8 | Active | Black | Tray | -55°C ~ 125°C | Surface Mount | Solder | Board Guide, Board Lock, Locking Ramp | 120 | 2 | Female | Gold | 30.0µin (0.76µm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 60 | 0.062" (1.57mm) | Dual | - | |||
|
|
|
70,660
오늘 배송 + 무료 배송
|
Samtec Inc. | .8MM HIGH SPEED DUAL VERTICAL MO | Edge Rate™ HSEC8 | Active | Black | Tray | -55°C ~ 125°C | Surface Mount | Solder | Board Guide, Board Lock, Locking Ramp | 80 | 2 | Female | Gold | 30.0µin (0.76µm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 40 | 0.062" (1.57mm) | Dual | - |
